2-Layer CLTE-MW PCB 2.9mil Core Laminate with Immersion Gold Finish for millimeter-wave and high-frequency applications

2-Layer CLTE-MW PCB | 2.9mil Core | Immersion Gold Finish

Product Overview

We are pleased to present this newly customized 2-layer rigid PCB engineered for millimeter-wave and high-frequency applications where thickness constraints are critical. Built on CLTE-MW laminate—a high-performance, cost-effective material system—this board is specifically designed for 5G and other millimeter-wave designs requiring precise signal-to-ground spacing.

The board measures 76.4mm x 95mm (single piece) with an extremely thin finished thickness of just 0.15mm and dimensional tolerance of ±0.15mm. Minimum trace and space are 6/7 mils, with a minimum finished hole size of 0.25mm. No blind vias are used in this construction.

A notable feature of this design is the use of black top silkscreen for component identification, while both top and bottom solder mask are omitted to preserve signal integrity at high frequencies. The Immersion Gold surface finish provides excellent solderability, flatness for fine-pitch components, and superior corrosion resistance. Every board undergoes 100% electrical testing prior to shipment and conforms to IPC-Class-2 quality standards. Gerber files are supplied in RS-274-X format, and worldwide shipping is available.

PCB General Specifications

Material Advantages

The CLTE-MW laminate system is uniquely designed for applications with thickness limitations due to physical or electrical constraints. Available in seven thickness options from 3 to 10 mils, CLTE-MW ensures ideal signal-to-ground spacing exists for 5G and other millimeter-wave applications. The laminate is reinforced with spread glass, which—along with a high filler loading—helps minimize high-frequency glass weave effects on electromagnetic wave propagation. This results in more consistent impedance control and reduced signal distortion, particularly critical at millimeter-wave frequencies.

Key material features include a low loss tangent of 0.0015 at 10GHz, low Z-axis CTE of 30ppm/°C for excellent plated through-hole reliability, thermal conductivity of 0.42 W/(m·K) for good heat dissipation in aggressive designs, and UL94 V-0 flammability rating. These characteristics enable low-loss designs, reliable mechanical performance under thermally challenging environments, and compatibility with commercial applications.

CLTE-MW Material Properties

PCB Stackup & Construction

The board features a very thin 2-layer stackup: 1oz copper (35μm) – CLTE-MW core (0.076mm / 2.99mil) – 1oz copper (35μm). Total finished board thickness is just 0.15mm, making this PCB exceptionally thin and flexible for space-constrained applications. Minimum trace and space are 6/7 mils, with a minimum finished hole size of 0.25mm. Via plating thickness is 20μm, and no blind vias are used. The design supports 19 components, 36 total pads (21 thru-hole, 15 top SMT), 12 vias, and 4 nets.

Typical Applications

Commercial communications and avionics

Military and aerospace applications

Microwave feed networks

Phase-sensitive electronic structures

Satellite communication systems

Passive components such as couplers, filters, and baluns

5G and millimeter-wave systems requiring precise signal-to-ground spacing

All PCBs are 100% electrically tested and shipped with a Certificate of Conformance per IPC-6012. For Gerber review, stackup confirmation, or volume pricing, please contact our technical sales team.